Cleaning
The processes used to clean your kit are of paramount importance. As technology moves the industry into ever-shrinking geometries, larger wafer sizes, and associated higher tool expenditures, we must find innovations into new cleaning processes that prolong kit life, reduce particles, and increase tool efficiency. At Pentagon Technologies, we constantly reevaluate and fine-tune our processes to meet your needs, incorporating a robust continuous improvement program (CIP) that takes full advantage of the long-term relationships we build with our clients.
Regardless of the size or capabilities of your fab, our facilities can handle your demands. We have years of experience in cleaning parts from every major OEM, and we provide services for all 150 mm, 200 mm and 300 mm fabs. Every one of our facilities features unmatched 300mm process solutions for all OEM tool manufacturers, including:
- PVD
- CVD
- Etch
- Ion Implant
- Diffusion
Process Control
Our commitment to you includes taking additional steps to monitor, analyze, and track every step of every cleaning process. All of our processes are copper segregated, and we have passed audits for our copper segregation from the largest manufacturers in the world. Our chemicals, tools and facilities are closely monitored – ensuring that every cleaned part meets stringent tolerances.
Every part serviced at our facilities receives Surface Particle Analysis by the Pentagon Technologies QIII+® Surface Particle Detector and must pass a specification of no greater than 3.9 particles per cm2 at 0.3µ – the most precise measurement available today – before being shipped to your facility.