QIII+® Surface Particle Detector

Inline Image Sample
The Methodology

To prove the power of the QIII+®, Pentagon worked with a leader in microprocessor manufacturing to develop a preventative maintenance Best Known Method (BKM) for a state-of-the-art SIP Cu/Ta process. Our technical team developed the BKM specific to the chamber, the process and the fab environment. The BKM included wet clean procedures and maximum allowable surface particle levels for specific areas within the chamber. The process owner uploaded these procedures into the QIII+® for use by Technicians during the PM.

Results

The tool consistently qualifies the first time and manifests lower particle counts. The particle counts remain lower than historic defect counts because the sources of particles were removed from the chamber. Technicians now have an improved cleaning procedure that provides a consistent, known particle level on all critical surfaces for every preventative maintenance cycle.

Tool time is valued at $10,000 per hour. The improved cleaning process and consistent use of the QIII+® eliminated the need for a second PM, eliminating 3.5 hours of unutilized tool time and saving an average of $35,000 per preventative maintenance cycle.

Knowledge is critical.

You don’t have the luxury of guessing whether your chamber is clean.  Particles adversely impact the overall effectiveness of your process equipment, decrease tool availability, consume test and conditioning wafers, and increase defects. But how do you find them? How do you know when your chambers and critical parts are clean?

We have the answers you need. Pentagon’s QIII+® Surface Particle Detector is the industry standard for establishing the cleanliness of your tool and work surfaces. With Pentagon’s patented surface measuring technology, you can instantly assess the cleanliness of any surface and measure the effectiveness of your cleaning procedures. With consistent use of the QIII+®, our customers have realized fab-wide defect reduction and increased productivity. 

The Problem

Semiconductor manufacturing tools frequently fail to return to production after intrusive preventative maintenance because the chamber has not been cleaned properly. This is typically due to insufficient PM cleaning.

But, maintenance technicians cannot see the particles they are attempting to clean and often actually add particles to a chamber during the cleaning procedure. Approximately 30% of tool PMs fail first-time qualification, resulting in additional test wafers or re-cleaning, leading to lost productivity and increased costs.

Solution: Start Clean

Our customers needed a way to pinpoint particle sources and develop better cleaning methods, ensuring a predictable PM and a first-time qualification.

The QIII+® Surface Particle Detector enabled us to meet this need. It allows instantaneous measurement of particles on any surface to 0.3µ. Technicians using the QIII+ can wet clean a process chamber to a specific particle level, thereby ensuring a clean start with lower particle adders.  Particle levels are documented at each step during the wet clean, allowing immediate reaction to failures before closing the chamber. This creates a better cleaning methodology that returns the tool to a production state more quickly. The QIII+® provides an improved and consistent maintenance procedure, specific to your tool and your process.

Features and Benefits
  • V2i – interactive Best Known Methods can be integrated into the operating system for repeatable process control
  • Particle Analysis Module allows for capture of measured particles for laboratory analysis and source identification
  • Barcode reader capable for ease of data ID entry
  • Battery operated, portable unit weighing only 20 lbs.
  • Smart Probe allows quick and error free probe change out
  • Web enabled for downloading and data management
  • State-of-the-art laser optics meeting stringent industry standards
Technical Data

Specifications subject to change

  • Size:  9.4” W x 17” D x 12” H
  • Input power:  100-240 VAC, 50/60 Hz
  • Display:  6.5” FPD with touch screen
  • GUI:  Windows CE
  • Sensor:  Laser diode with O.3µ sensitivity
  • Output:  Ethernet
Probe Options

Standard:

  • 2” Straight probe kit with Vespel  faceplate and 1/2” right angle with Vespel faceplate

Optional:

  • 3” Straight; 2” and 3” Right Angle